Minimum Requirement: 7+ years manufacturing engineering experience with BS degree, MS in ME or EE preferred
Plus: Agile, Oracle or equivalent MRP system
Language: Bilingual in English and Mandarin
Responsibilities:
1. Provide process engineering expertise in the area of SMT, thru hole general printed circuit board processing and box build assembly.
2. Familiar with BOM structure and provide assembly instruction to contract manufacturers.
3. Involvement in the front end board layout working with design engineers and board designers to meet requirements for assembly processing and testing. Resolve any design for manufacturability and design for testability issues.
4. Provide yield and failure analysis as it pertains to circuit board processes and unit assembly.
5. Work with component engineering to evaluate second source parts and to build the AVL.
6. Work with hardware eng., software eng. and QA to resolve pending technical issues effecting both development and production hardware.
7. Aid in the development of processes and procedures for the department. Provide leadership in the development of new products from the manufacturing, process and mechanical engineering perspective. Aid in packaging design.
8. Be the owner of product(s) into manufacturing and after they are in production.
9. Travel between US and China may require in a quarterly basis
